- Shenzhen Hothree Technology Co., Ltd.
- Main products: Thermal insulation material, Laird EMI, Bergquist thermal pad
Home > Products > Bergquist GAP PAD > BERGQUIST GPHC5.0 GAP PAD HC 5.0 GAP PAD TGP HC5000
BERGQUIST GPHC5.0 GAP PAD HC 5.0 GAP PAD TGP HC5000
- 1000 Sheet / Sheets per Month
- SHENZHEN
- T/T
- 1 days
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Product Details
| Brand Name | Bergquist | Place of Origin | United States | |
| Model Number | GPHCV5.0 | Material | Fiberglass | |
| Type | Insulation Sheet | Application | High Voltage | |
| Rated Voltage | 17.5pai | Tensile Strength | 5000VAC |
Product Description
BERGQUIST GPHC5.0 GAP PAD TGP HC5000 Formerly known as GAP PAD HC 5.0
BERGQUIST GAP PAD TGP HC5000(Thermal Conductivity Silicone Sheet) is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on
components and boards during assembly.BERGQUIST GAP PAD HC 5.0 (Thermal Conductive Insulating Silicone Gasket)maintains a conformable nature that
allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.BERGQUIST GPHC5.0(Thermal Silicone Pad) is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.The top side has minimal tack for ease of
handling. BERGQUIST GAP PAD TGP HC5000 is supplied with protective liners on both sides.
Contact Us
- Shenzhen Hothree Technology Co., Ltd.
- Contact nameCarrie Chat Now
- Phone86-755-86652465
- Addresslonggang, Shenzhen, Guangdong
Product Categories
| Bergquist hi-flow | Bergquist GAP PAD | Laird therml pad | BERGQUIST SIL PAD |
| hothree thermal pad | BERGQUIST BOND-PLY | Fujipoly | DENKA |
| PARKER LORD | Honeywell | LOCTITE |
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